Reactive ion etch (RIE) is used to etch the oxide in a controlled manner. The RIE facility (Fig. B.3) uses CF4 as the etching plasma.
|
|
| Figure B.3. Onsite Reactive Ion Etch. |
Reactive ion etch (RIE) is used to etch the oxide in a controlled manner. The RIE facility (Fig. B.3) uses CF4 as the etching plasma.
|
|
| Figure B.3. Onsite Reactive Ion Etch. |