A Solitec high speed wafer spinner (Fig. B.2a) is used for uniformly coating photoresist. An HTG contact mask printer with $2 \mu\textrm{m}$ line print resolution uses a $200 \textrm{W}$ UV lamp source to expose the photoresist (Fig. B.2b) using 5-inch glass masks typically patterned with chrome.
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| Figure B.2. Photolithographic Equpiment. a) Solitec high speed wafer spinner for uniform coating of photoresist. b) Contact mask printer with 200 W UV lamp source and 2 $\mu$m line printing resolution. | ||||
