0.4 | Table of Contents

List of Tables

List of Figures

CHAPTER 1: INTRODUCTION

1.1 Technological Motivation

1.2 Thin Films

1.3 Epitaxy

1.3.1 Bulk Defects

1.3.2 Bulk Diffusion Model

1.4 Surfaces

1.4.1 Identification

1.4.2 Si(111) Surface Reconstruction

1.4.3 Si(100) Surface Reconstruction

CHAPTER 2: SOLID METAL MEDIATED EPITAXY

2.1 Overview

2.2 Predecessor Technologies

2.2.1 Liquid Metal Mediated (LMM) Epitaxy

2.2.2 Solid Phase Epitaxy (SPE)

2.3 SMME Model

2.4 SMME Diffusion Mechanisms

2.4.1 Idealized Solution of Diffusion Equation

2.4.2 Numerical Considerations

2.5 Atomistic Growth Model

CHAPTER 3: SILICON ON INSULATOR

3.1 SMM-SOI Predecessors

3.1.1 Solid Phase Epitaxy

3.1.2 Oxygen Implantation

3.1.3 Wafer Bonding

3.2 SMM-SOI

3.2.1 Ideal Growth Model

CHAPTER 4: EXPERIMENT

4.1 Overview

4.2 Wafer Preparation

4.2.1 Oxidation

4.2.2 Photolithography

4.2.3 Oxide Etch

4.2.4 UV/Ozone Cleaning

4.3 Deposition Preparations

4.3.1 Chamber and Component Preparations

4.3.2 Final Wafer Cleaning

4.4 Epitaxial Deposition

4.4.1 Deposition of Aluminum Mediator

4.4.2 Deposition of Silicon Diffiusor

4.5 Substrate Heater/Holder Assembly

4.6 Temperature Calibration

CHAPTER 5: GENERAL ANALYSIS

5.1 Solid Metal Mediated Epitaxy (SMME)

5.1.1 SI(111)

5.1.2 Si(100)

5.2 SMM-SOI

5.2.1 Oxide Pattern Verification

5.2.2 SMM-SOI Si(111)

5.2.3 SMM-SOI Si(100)

5.3 TEM Investigation of SMM-SOI Si(100)

5.4 Al Island Formation on SMM-SOI

5.4.1 SMM-SOI Process Investigation

CHAPTER 6: DISCUSSION

6.1 Solid Metal Mediated Silicon on Insulator

6.1.1 SMME on Unpatterned SI(100) & Si(111)

6.1.2 SMM-SOI: SMME on Oxide-Patterned Si(100) & Si(111)

6.1.3 Lateral Si Diffusion

6.2 Conclusions

APPENDIX A: MATHEMATICAL FORMULATION

A.1 Superposition of Solutions

A.2 Inverse Fourier Transform

A.3 \int_0^\infty e^{-x^2}dx

A.4 erf(x)

APPENDIX B: ONSIDE FACILITIES

B.1 Clean Room Facilities

B.1.1 Thermal Oxidation Furnace

B.1.2 Photolithography

B.1.3 Reactive Ion Etch

B.1.4 Additional Wafer Preparation Facilities

B.2 Scanning Electron Microscope

B.3 High Resolution Optical Microscope

B.4 MBE System

B.4.1 Deposition Chamber

B.4.2 Analysis and Preparation Chamber

B.4.3 Load Lock Entry Chamber

B.5 TEM Facilities

APPENDIX C: ELECTRON DIFFRACTION PATTERNS